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To solve the limitations of the hot-air heating BGA chip repair control system in the high-density device layout environment of the mobile phone motherboard, a BGA Chips Repair System based on intelligent temperature control of laser selected areas is studied. Firstly, the Googol GTN card is chosen as the core control unit by combined with an infrared thermometer, three-stage transmission, a Vertu camera, a fiber laser and motor platform to design temperature acquisition unit, motor control unit, image positioning unit and laser control unit. Secondly, the upper computer detection and control software system is developed by using MFC technology in Windows operating system. Then, a fuzzy PID control algorithm of laser selective heating is designed to detect and control of motor, temperature and laser. Finally, experimental results show that the proposed system has high precision in temperature control of laser selected areas, and has the advantages of simple operation, short time delay and high stability, which has a good popularization value.