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In order to meet the requirements of long communication distance and high transmission reliability between the new low temperature launch vehicle and ground, A set of miniaturized full redundancy and high-speed communication device was developed with the architecture of ZYNQ. The device realizes expansibility of the module through the split structure design, realizes the physical layer interface, link layer framing and deframing, on-board timing and logic control through FPGA, realizes system resource scheduling, data storage, network communication and dual network port binding through ARM, realizes high-performance transmission by adopting multi DMA channel parallel transmission mode in AXI bus. Compared with the traditional device, the device designed in paper not only reduced the size to a quarter, reduced the cost to a third, doubled the communication rate, but also achieved higher reliability.