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A high-temperature piezoresistive pressure sensor with integrated signal conditioning circuit is designed and manufactured, which consists of flip-chip pressure sensitive film, passive resistance temperature compensation circuit and signal conditioning circuit.The production of pressure-sensitive chips uses SOI materials and MEMS standard technology, and the temperature compensation and signal conditioning circuits use high-temperature electronic components.Experiments show that passive resistance temperature compensation has significant effects. In addition, a high-temperature signal conditioning circuit is used to improve the output sensitivity of the sensor, and temperature compensation is used to reduce the output sensitivity.Compared with the traditional empirical algorithm, the proposed passive resistance temperature compensation technology has a smaller temperature drift,The output sensitivity of the sensor is 4.93mV/100KPa under the condition of 220℃, and the overall measurement accuracy of the sensor is ±2%FS..In addition, because the output voltage of the flexible sensor is adjustable, there is no need to use a general voltage converter to follow the pressure transmitter, which greatly reduces the cost of the test system, and is expected to be highly applied in pressure measurement in harsh environments.