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This study was focused on edge imformation collecting and processing of TSV wafer pre-alignment. Compared to standard wafers TSV wafers have features of being thinned or deflected when bonding, with burrs and flaws around the wafer edge, notch with remnant glues and copper in it being covered, which results in failure in traditional pre-alignment based on 1-dimensional image collecting and processing sampled by line CCD. Aiming to TSV wafers, the 1-demensional images sampled by line CCD were put together to form a 2-demensional image, working in with scanning motion. The wafer edge information was collected via 2-demensional image processing technology, the center position was recognized via least square round fitting method, two notch hypotenuses whose jointing point was regarded as notch position were recognized via Hough line transform, thus an automatic TSV wafer pre-aligning method was achieved. The method has been proved its precision and efficiency are up to the standard by practical test, with the repeatability less than 20u m and consuming time less than 40s, providing strong support for lithography exposing TSV wafers.