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Phase measurement profilometry based μm size 3D inspection was widely used in automation manufacturing line. However, conventional phase unwrapping for the inspection suffered from image noise or phase break. In electronic PCB SMT assembly line, considering plain area segmented from 2D image, a new phase unwrapping method was proposed that wrapped phases can be shift close to plain estimated from the PCB plain area and quadric fitting was taken from unwrapped phases for base plain under the measured object. Contrast experimental results show the method effectively improved performance in robust, speed and anti-interference of noise, break and shadow.