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For the question of frequency occurrence of solder joint failure for FPGA BGA package, presents a FPGA-based BGA solder joint failure monitoring model and implementation; analysis of the FPGA"s BGA solder joint failures principle; specify the solder area prone to failure based IPC7095B, and constructed in accordance with Ohm"s law detection model; based on Xilinx FPGA implementation of health information management for joints, and different testing standards were compared.